Thermal processes modeling during soldering of BGA components to PCB

// <I>Electronics' 2008<D> : Proc. National forum "Electronics 2008", Sofia, 2008, 4, 2008, p. 127-133.

P. Mashkov; T. Pencheva; B. Gyoch

Thermal processes modeling during soldering of BGA components to PCB

Детайли

Допълнителна информация

ISBN: ISSN 1314-0078
Отрасъл: Художествена литература
Системен №: 16562
Допълнителна сигнатура: T 44

Действия

APA Chicago / Turabian (16th edition) Harvard MLA (7th edition)

Mashkov, P., Pencheva, T., Gyoch, B. Thermal processes modeling during soldering of BGA components to PCB, , , ISSN 1314-0078.

Mashkov, P., Pencheva, T., Gyoch, B. . Thermal processes modeling during soldering of BGA components to PCB. : , , ISSN 1314-0078.

Mashkov, P., Pencheva, T., Gyoch, B. () Thermal processes modeling during soldering of BGA components to PCB, : , ISSN 1314-0078

Mashkov, P., Pencheva, T., & Gyoch, B. (). Thermal processes modeling during soldering of BGA components to PCB. // <I>Electronics' 2008<D> : Proc. National forum "Electronics 2008", Sofia, 2008, 4, 2008, p. 127-133..